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Technology Briefs

 

High Tech

Design simulation for the high tech market requires tools that provide accurate results to realistic analyses quickly. Design cycles are short and so are not always compatible with the time required for physical testing of components. Virtual prototyping and qualification allows designers to run through more iterations, while considering complex interactions between loading regimes, leading to improved products.

The Abaqus Unified FEA product suite from SIMULIA allows you to standardize simulation for drop testing and packaging, while advancing state-of-the-art in lifecycle prediction. Whether you manufacture high tech electronic products for Consumer, Industrial, or Automotive markets, or you are working on mission critical applications for aerospace, you will benefit from our full range of simulation capabilities.

Our solution includes advanced material models for electronics applications, modern progressive fracture/failure capabilities, best-in-class solver performance, and interactive capabilities to make model generation and preparation more efficient.

Solution Capabilities

  • Unified modeling and simulation environment based on Abaqus/CAE
  • Simulation methods to allow robust coupled-field analyses of thermal, electrical, mechanical (both static and dynamic), and moisture-sensitivity load regimes
    • Multiple load types can be applied to a single model
    • Techniques available to efficiently handle the problems of different size scales typically found in electronic assemblies
  • Process automation available to capture expert-generated workflows for deployment to non-FEA-expert users

 

 

high tech
high tech

User Conference Paper
Temperature Cycling Analysis of Lead-Free Solder Joints in Electronic Packaging

Intel Technology Development Ltd. and SIMULIA China
>> Download Now

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